MediaTek has officially unveiled the Dimensity 9400+, the latest flagship system-on-chip (SoC) in its Dimensity family. Designed to power next-generation Android experiences, the Dimensity 9400+ delivers major leaps in on-device generative and agentic AI, gaming graphics, and connectivity, all while maintaining superior power efficiency.

At the core of the Dimensity 9400+ is its All Big Core design, featuring one high-performance Arm Cortex-X925 core running at up to 3.73GHz, alongside three Cortex-X4 and four Cortex-A720 cores. This architecture provides top-tier single and multithreaded performance to support fluid Android experiences across demanding applications, multitasking, and real-time AI workloads.

Equipped with the powerful MediaTek NPU 890, the Dimensity 9400+ enables fast, power-efficient support for a wide array of Large Language Models (LLMs). It supports advanced AI techniques including Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing.

For developers building next-gen AI tools, MediaTek has also integrated its Dimensity Agentic AI Engine (DAE), which simplifies the process of transforming traditional AI apps into agentic AI applications. The chipset also introduces Speculative Decoding+ (SpD+), boosting agentic AI performance by up to 20%, ensuring faster and more context-aware responses.

The Dimensity 9400+ features a 12-core Arm Immortalis-G925 GPU, bringing console-class visual fidelity to mobile gaming. Support for opacity micromap (OMM) technology enhances realism in complex visuals such as hair, feathers, and foliage—without compromising performance.

The inclusion of MediaTek’s Frame Rate Converter 2.0+ (MFRC 2.0+), developed in collaboration with game developers, doubles effective frame rates and improves power efficiency by up to 40%, enabling extended gaming sessions with smoother gameplay and reduced battery drain.

With MediaTek Imagiq 1090, users can record HDR video across the entire zoom range, delivering professional-grade quality even when capturing distant subjects. Combined with Smooth Zoom and intelligent subject tracking, the chipset enables seamless video transitions while isolating desired visuals and audio from busy scenes.

Next-Gen Connectivity & Expanded Range

The Dimensity 9400+ pushes boundaries in connectivity with several firsts:

• 10km phone-to-phone Bluetooth range—6.6 times greater than its predecessor
• BeiDou satellite support with 33% faster TTFF, even when offline
• Tri-band Wi-Fi 7 concurrency with five data streams
• MediaTek Xtra Range 3.0, providing up to 30 meters of extra Wi-Fi coverage
• 5G/4G Dual SIM Dual Active (DSDA) with Dual Data capabilities for flexible mobile access

The first smartphones powered by the Dimensity 9400+ will hit the market starting this month, starting with the OPPO Find X8 Ultra that was just launched in China.